Performance Analysis of Heat Sink

Muthusamy K , Prem kumar S , Madhu A K , Srinivasagam ramesh , Muthiah A

Flexural Strength, Shear Strength, ANSYS Software.

All electronics devices dissipate heat to a large extent. Sufficient cooling is required to maintain their transistors; an electronic device is used in several applications. We have considered the transistor in the electrical contractor application. Our aim is to design a heat sink which could efficiently remove the heat dissipated by the transistor. In this project different materials heat sink for same base area and same heat input is considered and performance of the heat sink is analysis. The experimental analysis for aluminum and copper fins.

Published Paper   E-Certificate

"Performance Analysis of Heat Sink", IJSDR - International Journal of Scientific Development and Research (www.IJSDR.org), ISSN:2455-2631, Vol.6, Issue 5, page no.231 - 234, May-2021, Available :https://ijsdr.org/papers/IJSDR2105039.pdf

Volume 6 Issue 5, May-2021

Pages : 231 - 234

Paper Reg. ID: IJSDR_193263

Published Paper Id: IJSDR2105039

Downloads: 000347184

Research Area: Engineering

Country: Sivakasi,Virudhunagar, Tamilnadu, India

Published Paper PDF: https://ijsdr.org/papers/IJSDR2105039

Published Paper URL: https://ijsdr.org/viewpaperforall?paper=IJSDR2105039

ISSN: 2455-2631 | IMPACT FACTOR: 9.15 Calculated By Google Scholar | ESTD YEAR: 2016

An International Scholarly Open Access Journal, Peer-Reviewed, Refereed Journal Impact Factor 9.15 Calculate by Google Scholar and Semantic Scholar | AI-Powered Research Tool, Multidisciplinary, Monthly, Multilanguage Journal Indexing in All Major Database & Metadata, Citation Generator

Publisher: IJSDR(IJ Publication) Janvi Wave

This work is licensed under a Creative Commons Attribution 4.0 International License and The Open Definition